FinFETs with Different Fin Height and EPI Height Setting

ABSTRACT

An integrated circuit structure includes a first semiconductor strip, first isolation regions on opposite sides of the first semiconductor strip, and a first epitaxy strip overlapping the first semiconductor strip. A top portion of the first epitaxy strip is over a first top surface of the first isolation regions. The structure further includes a second semiconductor strip, wherein the first and the second semiconductor strips are formed of the same semiconductor material. Second isolation regions are on opposite sides of the second semiconductor strip. A second epitaxy strip overlaps the second semiconductor strip. A top portion of the second epitaxy strip is over a second top surface of the second isolation regions. The first epitaxy strip and the second epitaxy strip are formed of different semiconductor materials. A bottom surface of the first epitaxy strip is lower than a bottom surface of the second epitaxy strip.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional of U.S. patent application Ser. No.14/277,160, filed on May 14, 2014 which application is acontinuation-in-part of U.S. application Ser. No. 14/046,188, filed onOct. 4, 2013 now U.S. Pat. No. 8,748,993 which is a continuation of U.S.application Ser. No. 13/764,549, filed on Feb. 11, 2013 now U.S. Pat.No. 8,673,709 which is further a divisional of U.S. patent applicationSer. No. 12/843,595, filed Jul. 26, 2010 now U.S. Pat. No. 8,373,238,which application further claims the benefit of U.S. ProvisionalApplication No. 61/266,427 filed on Dec. 3, 2009, which applications arehereby incorporated herein by reference.

BACKGROUND

With the increasing down-scaling of integrated circuits and increasinglydemanding requirements for higher speed of integrated circuits,transistors need to have higher drive currents with increasingly smallerdimensions. Fin field-effect transistors (FinFETs) were thus developed.FinFETs have increased channel widths because the channels includesidewall portions in addition to the portions on the top surfaces of thefins. Since the drive currents of transistors are proportional to thechannel widths, the drive currents of FinFETs are increased over that ofplanar transistors.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 10 are cross-sectional views of intermediate stages inthe manufacturing of semiconductor fins having different fin heights inaccordance with an embodiment;

FIGS. 11A through 16B are cross-sectional views and perspective views ofintermediate stages in the manufacturing of a FinFET in accordance withanother embodiment;

FIG. 17 illustrates device regions in a semiconductor chip;

FIG. 18 illustrates a static random access memory including two FinFETswith fins having different fin heights;

FIGS. 19 through 30 are cross-sectional views of intermediate stages inthe manufacturing of FinFETs have different channel materials inaccordance with some embodiments; and

FIGS. 31 and 32 are cross-sectional views of intermediate stages in themanufacturing of FinFETs have different channel materials in accordancewith some alternative embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

A method for forming semiconductor fin(s) with different fin heightsand/or different epitaxy heights and the respective Fin Field-effectTransistor(s) (FinFET(s) is provided. The intermediate stages in themanufacturing of the FinFETs in accordance with some embodiments areillustrated. The variations of the embodiments are discussed. Throughoutthe various views and illustrative embodiments, like reference numbersare used to designate like elements.

Referring to FIG. 1, semiconductor substrate 20 is provided. In anembodiment, semiconductor substrate 20 includes silicon. Other commonlyused materials, such as carbon, germanium, gallium, arsenic, nitrogen,indium, and/or phosphorus, and the like, may also be included insemiconductor substrate 20.

Semiconductor substrate 20 includes a portion in device region 100 and aportion in device region 200. In an embodiment, device regions 100 and200 are different regions selected from the group consisting essentiallyof a logic core region, a memory region (such as an embedded staticrandom access memory (SRAM) region), an analog region, an input/output(IO, also referred to as a peripheral) region, a dummy region (forforming dummy patterns), and the like. The above-referenced deviceregions are schematically illustrated in FIG. 17. In an exemplaryembodiment, device region 100 is a logic core region, while deviceregion 200 is an IO region. In alternative embodiments, device region100 is a p-type FinFET region, while device region 200 is an n-typeFinFET region.

Pad layer 22 and mask layer 24 may be formed on semiconductor substrate20. Pad layer 22 may be a thin film comprising silicon oxide formed, forexample, using a thermal oxidation process. Pad layer 22 may act as anadhesion layer between semiconductor substrate 20 and mask layer 24. Padlayer 22 may also act as an etch stop layer for etching mask layer 24.In an embodiment, mask layer 24 is formed of silicon nitride, forexample, using low-pressure chemical vapor deposition (LPCVD). In otherembodiments, mask layer 24 is formed by thermal nitridation of silicon,plasma enhanced chemical vapor deposition (PECVD), or plasma anodicnitridation. Mask layer 24 is used as a hard mask during subsequentphotolithography processes.

STI regions 30 (denoted as 30-1 and 30-2) are formed in semiconductorsubstrate 20. The depth of STI regions 30 may be between about 100 nmand about 250 nm, although different depths are also applicable. It isrealized, however, that the dimensions recited throughout thedescription are merely examples, and may be changed if differentformation technologies are used. The formation of STI regions 30 may beperformed using known methods, and hence the process details are notdescribed in detail herein.

Referring to FIG. 2, device region 100 is masked by photo resist 134,leaving device region 200 exposed. The exposed STI regions 30-2 are thenrecessed through an etching step, resulting in recesses 236 insemiconductor substrate 20. The resulting structure is shown in FIG. 3.The portions of semiconductor substrate 20 between recesses 236 thusbecome fins 238, which has a fin height denoted as H_(fin2). In anexemplary embodiment, fin height H_(fin2) is between about 15 nm andabout 30 nm, although it may also be greater or smaller. Photo resist134 is then removed.

Referring to FIG. 4, device region 200 is masked by photo resist 234,leaving device region 100 exposed. The exposed STI regions 30-1 are thenrecessed through an etching step, resulting in recesses 136, as is shownin FIG. 5. The portions of semiconductor substrate 20 between recesses136 thus become fins 138, which has a fin height denoted as H_(fin1). Inan exemplary embodiment, fin height H_(fin1) is between about 25 nm andabout 40 nm, although it may also be greater or smaller. Fin heightsH_(fin1) and H_(fin2) are different from each other. The fin heightdifference (H_(fin2)−H_(fin1)) may be greater than about 5 nm, or evengreater than about 10 nm. Further, a ratio of H_(fin1)/H_(fin2) may begreater than about 1.25, or even greater than about 1.33.

Next, as shown in FIG. 6, mask layer 24 and pad layer 22 are removed.Mask layer 24, if formed of silicon nitride, may be removed by a wetprocess using hot H₃PO₄, while pad layer 22 may be removed using dilutedHF acid, if formed of silicon oxide. It is noted that in the structureshown in FIG. 6, the portion of substrate 20 below the bottoms of STIregions 30 may be treated as a semiconductor substrate, while fins 138and 238 may be treated as being over the semiconductor substrate.

FIG. 7 illustrates the formation of FinFETs 160 and 260 in deviceregions 100 and 200, respectively. First, well dopants are introducedinto the exposed fins 138 and 238, for example, by implantations. In theembodiment in which device region 100 is a p-type FinFET region anddevice region 200 is an n-type FinFET region, an n-type impurityimplantation is performed to dope an n-type impurity such as phosphorousinto fins 138, and a p-type impurity implantation is performed to dope ap-type impurity such as boron into fins 238. For simplicity, the masksused for doping the wells are not shown. Gate dielectrics 150 and 250are formed to cover the top surface and sidewalls of fins 138 and 238,respectively. Gate dielectrics 150 and 250 may be formed by thermaloxidation, and hence may include thermal silicon oxide. Gate electrodes152 and 252 are then formed on gate dielectrics 150 and 250,respectively. In an embodiment, each of gate electrodes 152 and 252covers more than one of fins 138 and 238, so that each of the resultingFinFETs 160 and 260 comprises more than one fin 138 and 238,respectively. In alternative embodiments, each of fins 138 and/or 238may be used to form one FinFET. The remaining components of FinFETs 160and 260, including source and drain regions and source and drainsilicides (not shown), are then formed. The formation processes of thesecomponents are known in the art, and hence are not repeated herein.

FIGS. 8 through 10 illustrate an alternative embodiment. The initialstructure used in this embodiment is similar to what is shown in FIG. 1.Next, referring to FIG. 8, after the formation of photo resist 234 fordevice region 200, a first implantation is performed with a first dosageto introduce a first impurity into STI regions 30-1. The resulting STIregions 30-1 have a first impurity concentration. Next, as shown in FIG.9, photo resist 234 is removed, and photo resist 134 is formed. A secondimplantation is performed with a second dosage to introduce a secondimpurity into STI regions 30-2. The resulting STI regions have a secondimpurity concentration. In an exemplary embodiment, the first impurityincludes phosphorous, while the second impurity includes boron.

Next, as shown in FIG. 10, photo resist 134 is removed, and STI regions30 are recessed, for example, using a wet etch or other methods. Due tothe different impurity concentrations in STI regions 30-1 and 30-2, theetching rates of STI regions 30-1 and 30-2 are different, and hence theresulting fin heights H_(fin1) and H_(fin2) are different. Thedifference in fin heights H_(fin1) and H_(fin2) may be further increasedby making the pattern density of STI regions 30-1 different from thepattern density of STI regions 30-2 in order to introduce apattern-loading effect, so that the difference in etching rates of STIregions 30-1 and 30-2 is further increased. In alternative embodiments,no STI doping as shown in FIGS. 8 and 9 are performed. However, thepattern density of STI regions 30-1 is different from that of STIregions 30-2, and the pattern-loading effect is used to result in thefin height difference.

In subsequent steps, mask layer 24 and pad layer 22 are removed,resulting in the structure shown in FIG. 6. Processes are then continuedto form FinFETs 160 and 260, as shown in FIG. 7.

By differentiating fin heights in different device regions, the junctionwindow is increased, which means that the fin heights of FinFETs indifferent device regions are no longer tied together. With the FinFETsin different device regions having different fin heights, it is easierto tune the performance of devices in different device regions. Further,in the embodiment wherein FinFET 160 (FIG. 7) in device region 100 is ap-type FinFET and FinFET 260 in device region 200 is an n-type FinFET,the resulting fin height of p-type FinFET 160 is greater than the finheight of n-type FinFET 260. Accordingly, p-type FinFET 160 and n-typeFinFET 260 may be used in a same SRAM cell (FIG. 18). For example,p-type FinFET 160 may be a pull-up transistor, and n-type FinFET 260 maybe a pull-down transistor. The greater fin height H_(fin1) of p-typeFinFET 160 may compensate for the lower hole mobility compared to thehigher electron mobility of n-type FinFET 260. The performance of p-typeFinFET 160 and the performance of n-type FinFET 260 may thus bebalanced.

FIGS. 11A through 16B illustrate intermediate stages in themanufacturing of a FinFET in accordance with yet another embodiment,wherein the difference in the recessing depths of STI regions 30 areapplied to a single FinFET. First, referring to FIGS. 11A and 11B,semiconductor fin 310, which may be a silicon fin formed of the samematerial as the underlying semiconductor substrate 20, is formed. Theformation of semiconductor fin 310 may be essentially the same as theformation of fins 138 or 238 in FIGS. 2 through 6. FIG. 11A illustratesa lengthwise cross-section view, wherein the dotted lines indicate thatsemiconductor fin 310 and semiconductor substrate 20 are connectedthrough a semiconductor strip. FIG. 11B illustrates a widthwisecross-sectional view. The fin height of semiconductor fin 310 isH_(fin), and the fin width of semiconductor fin 310 is W_(fin).

Next, as shown in FIG. 12, which is a perspective view, gate dielectric314 and gate electrode 316 are formed. Gate dielectric 314 is formed onthe top surface and sidewalls of semiconductor fin 310. Gate electrode316 is formed on gate dielectric 314. Lightly doped source and drain(LDD) regions (not shown) may then be formed by implanting semiconductorfin 310. In an embodiment, slim spacers 318 as shown in FIG. 13 may beformed on the sidewalls of gate dielectric 314 and gate electrode 316,wherein LDD regions may be formed before or after the formation of slimspacers 318. Optionally, mask layer 317, which may be formed of anitride, is formed. FIG. 13 also illustrates mask layer 317.

Next, as shown in FIG. 14A, gate spacers 320 are formed. Gate spacers320 may include the previously formed slim spacers 318. It is realizedthat gate spacers 320 may have many different variations. For example,as shown in FIG. 14A, each gate spacer 320 may have anitride-oxide-nitride-oxide (NONO structure). In alternativeembodiments, each gate spacer 320 may only have a nitride layer on anoxide layer (referred to as an NO structure). The exposed portions ofSTI regions on opposite sidewalls of semiconductor fin 310 that is notcovered by gate electrode 316 are recessed. A perspective view of thestructure shown in FIG. 14A is shown in FIG. 14B. To clearly illustratethe heights of semiconductor fin 310, gate spacers 320 are not shown. Inthe resulting structure, semiconductor fin 310 has two heights. Theportion of semiconductor fin 310 (which also includes the channel regionof the resulting FinFET) covered by gate spacers 320 and gate electrode316 has fin height H_(fin), which fin height is the same as shown inFIG. 11B. As the result of the recessing of STI regions 30, the portionsof semiconductor fin 310 that are not covered have an increased finheight H_(fin′). In an embodiment, H_(fin′), is greater than fin heightH_(fin) by greater than about 2 nm, or even greater than about 10 nm.Alternatively, a ratio H_(fin′)/H_(fin) may be greater than about 1.05,and may even be greater than about 1.08, or between about 1.05 and about1.5.

Next, as shown in FIG. 15A, epitaxial semiconductor layers 324 areepitaxially grown on the exposed portions of semiconductor fin 310.Epitaxial semiconductor layers 324 may comprise silicon, germanium,carbon, and/or other known semiconductor materials. In an embodimentwherein the resulting FinFET is of p-type, epitaxial semiconductorlayers 324 may comprise silicon and possibly germanium in addition tosilicon. In alternative embodiments wherein the resulting FinFET is ofn-type, epitaxial semiconductor layers 324 may comprise silicon andpossibly carbon in addition to silicon. Thickness T of epitaxialsemiconductor layers 324 may be greater than about 10 nm.

FIG. 15B illustrates an additional cross-sectional view of the structureshown in FIG. 15A, wherein the cross-sectional view is obtained from thevertical plane crossing line 15B-15B in FIG. 15A. Fin height H_(fin) ismarked in FIG. 15B. FIG. 15C illustrates an additional cross-sectionalview of the structure shown in FIG. 15A, wherein the cross-sectionalview is obtained from the vertical plane crossing line 15C-15C in FIG.15A. Fin height H_(fin′), is marked in FIG. 15C. Comparing FIGS. 15B and15C, it is observed that due to the increased fin height H_(fin′), thevolume of epitaxial semiconductor layers 324 is increased. If the finheight of semiconductor fin 310 is not increased from value H_(fin) tovalue H_(fin′), epitaxial semiconductor layers 324 would have beenlimited in the region over dotted line 328. In FIGS. 15B and 15C,although there is no clear visible bottoms, semiconductor fins 310 areconsidered to have bottoms level with top surfaces of STI regions 30 onopposite sides of respective semiconductor fin portions 310.Accordingly, as shown in FIG. 15B, the bottom of the portion ofsemiconductor fin 310 directly under electrode 316 illustrated as line327, and in FIG. 15C, the bottom of the portion of semiconductor fin 310not covered by gate electrode 316 and gate spacers 320 is illustrated asline 329. Bottom 329 is lower than bottom 327.

Referring to FIG. 16A, implantations are performed to form source anddrain regions (not shown) in semiconductor fin 310 and epitaxialsemiconductor layers 324. Mask layer 317 is also removed, andsource/drain silicide regions 330 and gate silicide region 332 areformed on epitaxial semiconductor layers 324. The formation of thesource and drain regions and silicide regions 330 may adopt knownmethods. After the formation of silicide regions 330 and 332, epitaxialsemiconductor layers 324 may be fully, or partially, consumed. In theresulting structure, silicide regions 330 may be separated fromsemiconductor fin 310 by remaining portions of epitaxial semiconductorlayers 324, or contact semiconductor fin 310 directly.

FIG. 16B illustrates an additional cross-sectional view of the structureshown in FIG. 16A, wherein the cross-sectional view is obtained from thevertical plane crossing line 16B-16B in FIG. 16A. It is observed that byrecessing STI regions 30 before the epitaxial formation of epitaxialsemiconductor layers 324, the volume of the source and drain regions isincreased. This has the positive effect of reducing the current crowdingin the source and drain regions. The desirable tensile or compressivestress applied to the channel region of the resulting FinFET is alsoincreased due to the increased volume of stressed source and drainregions. In addition, since the size of silicide regions 330 is alsoincreased due to the increased sidewall areas of epitaxial semiconductorlayers 324, the current crowding effect in silicide regions 330 is alsoreduced.

FIGS. 19 through 30 illustrate cross-sectional views of intermediatestages in the formation of FinFETs in accordance with alternativeembodiments. Unless specified otherwise, the materials and the formationmethods of the components in these embodiments are essentially the sameas the like components, which are denoted by like reference numerals inthe embodiments shown in FIGS. 1 through 10. The details regarding theformation processes and the materials of the components shown in FIGS.19 through 30 may thus be found in the discussion of the embodimentshown in FIGS. 1 through 10.

Referring to FIG. 19, semiconductor substrate 20 is provided. In someembodiments, semiconductor substrate 20 has a first bandgap Eg0. Forexample, when semiconductor substrate 20 is a silicon substrate, bandgapEg0 is equal to about 1.12 eV. In alternative embodiments, semiconductorsubstrate 20 may be a silicon carbon substrate, a substrate germaniumsubstrate, a III-V compound semiconductor substrate, or the like.

A portion of semiconductor substrate 20 is located in device region 100and a portion in device region 200. In some embodiments, device region100 is a p-type FinFET region, while device region 200 is an n-typeFinFET region. In alternative embodiments, device region 100 is ann-type FinFET region, while device region 200 is a p-type FinFET region.In alternative embodiments, device regions 100 and 200 are differentregions selected from the group consisting essentially of a logic coreregion, a memory region (such as an SRAM region), an analog region, aninput/output (IO, also referred to as a peripheral) region, a dummyregion (for forming dummy patterns), and the like. The above-referenceddevice regions are schematically illustrated in FIG. 17.

Semiconductor substrate 20 is etched to form trenches 26. Pad layer 22and mask layer 24 (not shown, refer to FIG. 1) may also be formed beforethe etching of semiconductor substrate 20, wherein pad layer 22 and masklayer 24 are patterned using the same lithography process as the etchingof semiconductor substrate 20. The etching of semiconductor substrate 20may be performed using dry etch, so that the edges of trenches 26 aresubstantially straight. The remaining portions of semiconductorsubstrate 20 between trenches 26 are referred to as semiconductor strips28 (including 28-1 and 28-2) hereinafter. Semiconductor strips 28 areformed from the same material as the underlying portion of semiconductorsubstrate 20. Throughout the description, the semiconductor strips 28 indevice region 100 are referred to as semiconductor strips 28-1, and thesemiconductor strips 28 in device region 200 are referred to assemiconductor strips 28-2.

Referring to FIG. 20, isolation regions such as STI regions 30(including portions 30-1 and 30-2) are formed in trenches 26 (FIG. 19).STI regions 30 may include, for example, silicon oxide, silicon nitride,or the like. The formation methods of STI regions 30 include FlowableCVD (FCVD), spin-coating, or the like.

Referring to FIG. 21, device region 100 is masked by mask layer 132,leaving device region 200 exposed. In some embodiments, mask layer 132comprises a photo resist. In alternative embodiments, mask layer 132includes silicon oxide, silicon nitride, silicon carbide, or siliconoxynitride. Semiconductor strips 28-2 are then recessed through anetching step, resulting in recesses 235 in semiconductor substrate 20.The overlying pad layer and mask layer (not shown) are also removed.Recesses 235 have depth D2. In some embodiments, depth D2 is betweenabout 10 nm and about 50 nm, although different depths may be used.

Mask layer 132 may then be removed. In the embodiments in which masklayer 132 includes a non-photo material such as silicon oxide or siliconnitride, mask layer 132 may remain in device region 100 in thesubsequent epitaxy. Next, referring to FIG. 22, an epitaxy is performedto selectively grow epitaxy strips 237 in recesses 235 (FIG. 21).Semiconductor strips 28-2 are covered by a hard mask layer or mask layer132 if it has not been removed yet, and hence no semiconductor materialis grown in device region 100. Furthermore, even if mask layer 132 (FIG.21) is removed during the epitaxy, the pad layer and the hard mask layer(not shown) will also prevent semiconductor materials from growing fromsemiconductor strips 28-1. In some embodiments, epitaxy strips 237comprise a semiconductor material such as silicon carbon, siliconphosphorous, silicon germanium, or a III-V compound semiconductormaterial. The bandgap of epitaxy strips 237 is denoted as Eg2, which maybe greater than, substantially equal to, or lower than, bandgap Eg0 ofsemiconductor strips 28 and semiconductor substrate 20.

During the epitaxy, epitaxy strips 237 may be in-situ doped to form wellregions for the subsequently formed FinFET 260 (FIGS. 30 and 32) indevice region 200. For example, when FinFET device 260 is an n-typeFinFET, epitaxy strips 237 is in-situ doped to p-type. Conversely, whenFinFET device 260 is a p-type FinFET, epitaxy strips 237 is in-situdoped to n-type. After the epitaxy, a planarization such as a ChemicalMechanical Polish (CMP) is performed to level the top surface of epitaxyregions 237. For example, the top surfaces of epitaxy strips 237 may becoplanar with the top surfaces of hard masks (not shown, similar to hardmask 24 in FIG. 1). The resulting structure is shown in FIG. 23.

Referring to FIG. 24, device region 200 is masked by mask layer 232,leaving device region 100 exposed. In these embodiments, mask layer 232may comprise silicon oxide, silicon nitride, silicon carbide, or siliconoxynitride, wherein mask layer 232 is configured to sustain the hightemperatures used in the subsequent epitaxy. The exposed semiconductorstrips 28-1 are then recessed through an etching step, resulting inrecesses 135 in semiconductor substrate 20. Recesses 135 have depth D1.In some embodiments, depth D1 is between about 15 nm and about 80 nm,although different depths may be used. Furthermore, depth D1 is greaterthan D2. For example, the difference (D1−D2) may be greater than about 5nm, greater than about 10 nm, or greater than about 15 nm or higher.

Next, as shown in FIG. 25, an epitaxy is performed to selectively growepitaxy strips 137 in recesses 135. The epitaxy is performed with hardmask layer 232 covering device epitaxy strips 237 so that nosemiconductor material is grown from epitaxy strips 28-2. In someembodiments, epitaxy strips 137 comprise a semiconductor material suchas silicon carbon, silicon phosphorous, silicon germanium, or a III-Vcompound semiconductor material. The bandgap of epitaxy strips 137 isdenoted as Eg1, which may be greater than, substantially equal to, orlower than, bandgap Eg0 of semiconductor strips 28-1 and semiconductorsubstrate 20. Furthermore, the material of epitaxy strips 137 may bedifferent from or the same as the material of epitaxy strips 237.Accordingly, bandgaps Eg1 and Eg2 may be equal to or different from eachother.

During the epitaxy, epitaxy strips 137 may be in-situ doped to form wellregions for the subsequently formed FinFET 160 (FIGS. 30 and 32) indevice region 100. For example, when FinFET device 160 is a p-typeFinFET, epitaxy strips 237 is in-situ doped to n-type. Conversely, whenFinFET device 160 is an n-type FinFET, epitaxy strips 237 is in-situdoped to p-type. After the epitaxy, hard mask layer 232 is removed. Aplanarization such as a CMP may be performed to level the top surface ofthe epitaxy strips 237. In the resulting structure, the top surfaces ofepitaxy strips 137 are coplanar with the top surfaces of epitaxy strips237 and STI regions 30. The resulting structure is shown in FIG. 26.

Referring to FIG. 27, device region 100 is masked by photo resist 134,leaving device region 200 exposed. The exposed STI regions 30-2 are thenrecessed through etching, resulting in recesses 236 in device region200. The etching may be performed using a dry etching or a wet etching,wherein an etchant that attacks STI regions 30-2 and does not attackepitaxy strips 237 and semiconductor strips 28-2 is used. As a result,at least the top portions of epitaxy strips 237 are over the topsurfaces 30-2A of remaining STI regions 30-2. The portions of epitaxystrips 237 and semiconductor strips 28-2 over the top surfaces of theremaining STI regions 30-2 are referred to as semiconductor fins 238.Semiconductor fins 238 have a fin height denoted as H_(fin2). In someexemplary embodiments, fin height H_(fin2) is between about 10 nm andabout 60 nm. Photo resist 134 is then removed.

Depending on the recessing depth, the top surfaces 30-2A of STI regions30-2 may be at different levels. For example, as shown in FIG. 27, topsurfaces 30-2A may be level with the bottom surfaces of epitaxy strips237. Alternatively stated, fin height H_(fin2) is equal to heightH_(epi2) of epitaxy strips 237 in these embodiments. In otherembodiments, for example, when the bandgap Eg2 of epitaxy strips 237 ishigher than or equal to bandgap Eg0 of semiconductor strips 28-2, thetop surfaces 30-2A (dashed lines) of STI regions 30-2 are higher thanthe bottom surfaces of epitaxy strips 237. In yet other embodiments, forexample, when the bandgap Eg2 of epitaxy strips 237 is lower than orequal to bandgap Eg0 of semiconductor strips 28-2, top surfaces 30-2A(dashed lines) of STI regions 30-2 are lower than the bottom surfaces ofepitaxy strips 237. The respective top surfaces 30-2A of STI regions30-2 are illustrated using dashed lines.

Referring to FIG. 28, device region 200 is masked by photo resist 234,leaving device region 100 exposed. The exposed STI regions 30-1 are thenrecessed through etching, resulting in recesses 136. The portions ofsemiconductor substrate 20 between recesses 136 thus become fins 138,which have a fin height denoted as H_(fin1). In some exemplaryembodiments, fin height H_(fin1) is between about 10 nm and about 85 nm,although it may also be greater or smaller. Fin heights H_(fin1) andH_(fin2) are different from each other. The fin height difference(H_(fin2)−H_(fin1)) may be greater than about 5 nm or greater than about10 nm. Further, a ratio of H_(fin1)/H_(fin2) may be greater than about1.25 or greater than about 1.33. After the recessing of STI regions30-1, photo resist 234 is removed, leaving the structure shown in FIG.29.

Depending on the recessing depth, the top surfaces 30-1A ofsemiconductor fins 138 may be at different levels. For example, as shownin FIG. 29, top surfaces 30-1A may be level with the bottom surfaces ofepitaxy strips 137. Alternatively stated, fin height H_(fin1) is equalto the height H_(epi1) of epitaxy strips 137 in these embodiments. Inother embodiments, for example, when bandgap Eg1 of epitaxy strips 137is higher than or equal to bandgap Eg0 of semiconductor strips 28-1, topsurfaces 30-1A of STI regions 30-1 are higher than the bottom surfacesof epitaxy strips 137. In yet other embodiments, for example, when thebandgap Eg1 of epitaxy strips 137 is lower than or equal to bandgap Eg0of semiconductor strips 28-1, top surfaces 30-1A of STI regions 30-1 arelower than the bottom surfaces of epitaxy strips 137. The respective topsurfaces 30-1A of STI regions 30-1 are illustrated using dashed lines.

FIG. 30 illustrates the formation of FinFETs 160 and 260 in deviceregions 100 and 200, respectively. In some embodiments, well dopants areintroduced into the exposed fins 138 and 238 by, for example,implantations. In alternative embodiments, the well dopants have beenintroduced in the epitaxy of epitaxy strips 137 and 237, and hence nowell implantation is performed. Gate dielectrics 150 and 250 are formedto cover the top surfaces and the sidewalls of fins 138 and 238,respectively. Gate dielectrics 150 and 250 may be formed by a depositionstep such as CVD, a thermal oxidation, or the like. Gate electrodes 152and 252 are formed over gate dielectrics 150 and 250, respectively. Insome embodiments, each of gate electrodes 152 and 252 covers more thanone of fins 138 and 238 so that each of the resulting FinFETs 160 and260 comprises more than one fin 138 and 238, respectively. Inalternative embodiments, each of fins 138 and/or 238 is used to form oneFinFET. The remaining components of FinFETs 160 and 260, includingsource and drain regions and source and drain silicides (not shown), arethen formed. The formation processes are not discussed in detail herein.

As shown in FIG. 30, FinFETs 160 and 260 have different fin heightsH_(fin1) and H_(fin2), which are achieved by adjusting the epitaxy ofepitaxy strips 137 and 237 and the recessing of STI regions 30-1 and30-2. The drive currents of FinFETs 160 and 260 thus can be adjusted todesirable levels. For example, PMOS devices may need to have a strongerboost to their drive currents than NMOS devices. Hence, fin heightH_(fin1) is configured to be greater than fin height H_(fin2) whenFinFET 160 is a p-type FinFET and FinFET 260 is an n-type FinFET.

In addition, the drive currents of FinFETs 160 and 260 may also beadjusted by selecting appropriate semiconductor materials for FinFETs160 and 260. For example, by selecting appropriate semiconductormaterials for epitaxy strips 137 and 237 to have lower bandgaps Eg1 andEg2, respectively, the drive currents of FinFETs 160 and 260 areincreased. The desirable top surface level of STI regions 30 may also berelated to the bandgaps of epitaxy strips 137 and 237. For example, inthe embodiments in which bandgap Eg1 of epitaxy strips 137 is higherthan bandgap Eg0 of the underlying semiconductor strips 28-1, epitaxyheight H_(epi1) may be greater than fin height H_(fin1) so that thebottom portions of epitaxy strips 137 are lower than top surfaces 30-1Aof STI regions 30-1. The portions of semiconductor material immediatelyunderlying the channel of FinFET 160 affect the leakage current ofFinFET 160. With these portions being parts of epitaxy strips 137 thathave a higher bandgap, the leakage current is reduced. Conversely, inthe embodiments in which bandgap Eg1 of epitaxy strips 137 is lower thanbandgap Eg0 of the underlying semiconductor strips 28-1, epitaxy heightH_(epi2) may be smaller than fin height H_(fin1) so that the topportions of semiconductor strips 28-1 are higher than top surfaces 30-1Aof STI regions 30-1. This may also cause the reduction in the leakagecurrent of FinFET 160. For FinFET 260, the top surface level of STIregions 30-2 may also be configured similarly to FinFET 160 to reducethe leakage current.

FIGS. 31 and 32 illustrate the intermediate stages in the formation ofFinFETs 160 and 260 in accordance with alternative embodiments of thepresent disclosure. These embodiments differ from the embodiments inFIGS. 19 through 30 in that the top surfaces of STI regions 30-1 and30_2 are level with each other. The initial steps for forming thestructure in FIG. 31 include the steps in FIGS. 19 through 26. Next,referring to FIG. 31, STI regions 30-1 and 30-2 are recessedsimultaneously. Hence, fin heights H_(fin1) and H_(fin2) are equal toeach other. Next, as shown in FIG. 32, gate dielectrics 150 and 250 andgate electrodes 152 and 252 are formed, followed by the formation ofsource and drain regions (not shown) to finish the formation of FinFETs160 and 260.

In accordance with some embodiments, the bandgap Eg1 of epitaxy strips137 is greater than the bandgap Eg0 of the underlying semiconductorstrips 28-1, and the bandgap Eg2 of epitaxy strips 237 is smaller thanthe bandgap Eg0 of the underlying semiconductor strips 28-2.Accordingly, the top surfaces 30-1A of STI regions 30-1 and the topsurface 30-2A of STI regions 30-2 are higher than the bottom surfaces ofepitaxy strips 137 and lower than the bottom surfaces of epitaxy strips237 so that the leakage currents of both FinFETs 160 and 260 arereduced. In accordance with alternative embodiments, bandgap Eg1 ofepitaxy strips 137 and bandgap Eg2 of epitaxy strips 237 are bothgreater than the bandgap Eg0 of the underlying semiconductor strips 28.Accordingly, top surfaces 30-1A and 30-2A (illustrated using dashedlines) are higher than the bottom surfaces of both epitaxy strips 137and epitaxy strips 237 so that the leakage currents of both FinFETs 160and 260 are reduced. In accordance with alternative embodiments, thebandgaps Eg1 of epitaxy strips 137 and the bandgap Eg2 of epitaxy strips237 are both smaller than the bandgap Eg0 of the underlyingsemiconductor strips 28. Accordingly, top surfaces 30-1A and 30-2A(illustrated using dashed lines) are lower than the bottom surfaces ofboth epitaxy strips 137 and epitaxy strips 237 so that the leakagecurrents of both FinFETs 160 and 260 are reduced.

The embodiments of the present disclosure have some advantageousfeatures. With the epitaxy heights and the fin heights of two FinFETsadjusted in the epitaxy and STI recessing, the drive currents of twoFinFETs can be adjusted to desirable levels, and the leakage currents ofthe FinFETs may both be reduced.

In accordance with some embodiments of the present disclosure, anintegrated circuit structure includes a first semiconductor strip, firstisolation regions on opposite sides of the first semiconductor strip,and a first epitaxy strip overlapping the first semiconductor strip. Atop portion of the first epitaxy strip is over a first top surface ofthe first isolation regions. The structure further includes a secondsemiconductor strip, wherein the first and the second semiconductorstrips are formed of the same semiconductor material. Second isolationregions are on opposite sides of the second semiconductor strip. Asecond epitaxy strip overlaps the second semiconductor strip. A topportion of the second epitaxy strip is over a second top surface of thesecond isolation regions. The first epitaxy strip and the second epitaxystrip are formed of different semiconductor materials. A bottom surfaceof the first epitaxy strip is lower than a bottom surface of the secondepitaxy strip.

In accordance with alternative embodiments of the present disclosure, anintegrated circuit structure includes a first semiconductor strip, andfirst isolation regions on opposite sides of the first semiconductorstrip. The first isolation regions have first top surfaces. A firstepitaxy strip overlaps the first semiconductor strip, wherein a topportion of the first epitaxy strip is over the first top surfaces of thefirst isolation regions. The integrated circuit structure furtherincludes a second semiconductor strip, wherein the first semiconductorstrip and the second semiconductor strip are formed of a samesemiconductor material. Second isolation regions are on opposite sidesof the second semiconductor strip, wherein the second isolation regionshave second top surfaces higher than the first top surfaces. A secondepitaxy strip overlaps the second semiconductor strip. A top portion ofthe second epitaxy strip is over the second top surfaces of the secondisolation regions.

In accordance with yet alternative embodiments of the presentdisclosure, a method includes forming a first and a second plurality ofSTI regions in a semiconductor substrate. A first portion of thesemiconductor substrate between the first plurality of STI regions isconfigured as a first semiconductor strip, and a second portion of thesemiconductor between the second plurality of STI regions is configuredas a second semiconductor strip. The method further includes recessingthe first semiconductor strip to form a first recess having a firstdepth, performing a first epitaxy to grow a first epitaxy strip in thefirst recess, recessing the second semiconductor strip to form a secondrecess having a second depth different from the first depth, andperforming a second epitaxy to grow a second epitaxy strip in the secondrecess. The first plurality of STI regions and the plurality of STIregions are recessed to form a first semiconductor fin and a secondsemiconductor fin. The first semiconductor fin has a top portion of thefirst epitaxy strip, and the second semiconductor fin has a top portionof the second epitaxy strip.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first and a second plurality of shallow trench isolation (STI) regions in a semiconductor substrate, wherein a first portion of the semiconductor substrate between the first plurality of STI regions is configured as a first semiconductor strip, and a second portion of the semiconductor substrate between the second plurality of STI regions is configured as a second semiconductor strip; recessing the first semiconductor strip to form a first recess having a first depth; performing a first epitaxy to grow a first epitaxy strip in the first recess; recessing the second semiconductor strip to form a second recess having a second depth different from the first depth; performing a second epitaxy to grow a second epitaxy strip in the second recess; and recessing the first plurality of STI regions and the second plurality of STI regions to form a first semiconductor fin and a second semiconductor fin, respectively, wherein the first semiconductor fin comprises a top portion of the first epitaxy strip, and the second semiconductor fin comprises a top portion of the second epitaxy strip.
 2. The method of claim 1, wherein the recessing the first plurality of STI regions and the second plurality of STI regions comprises etching the first plurality of STI regions and the plurality of STI regions in different etching processes.
 3. The method of claim 2, wherein the first plurality of STI regions and the second plurality of STI regions are recessed using different etching masks.
 4. The method of claim 1, wherein the recessing the first plurality of STI regions and the second plurality of STI regions comprises etching the first plurality of STI regions and the second plurality of STI regions simultaneously.
 5. The method of claim 1, wherein the recessing the first plurality of STI regions and the second plurality of STI regions comprises: recessing the first plurality of STI regions, with top surfaces of remaining portions of the first plurality of STI regions being higher than a bottom surface of the first epitaxy strip; and recessing the second plurality of STI regions, with top surfaces of remaining portions of the second plurality of STI regions being lower than a bottom surface of the second epitaxy strip.
 6. The method of claim 5, wherein the first epitaxy strip has a first bandgap higher than a bandgap of the first semiconductor strip, and the second epitaxy strip has a second bandgap lower than a bandgap of the second semiconductor strip.
 7. The method of claim 5 further comprising: forming a first gate dielectric and a first gate electrode on a top surface and sidewalls of the first semiconductor fin; and forming a second gate dielectric and a second gate electrode on a top surface and sidewalls of the second semiconductor fin.
 8. The method of claim 1 further comprising performing planarization steps to level a top surface of the first epitaxy strip with a top surface of the second epitaxy strip.
 9. A method comprising: forming a first and a second plurality of shallow trench isolation (STI) regions in a semiconductor substrate, wherein a first portion of the semiconductor substrate between the first plurality of STI regions is configured as a first semiconductor strip, and a second portion of the semiconductor substrate between the second plurality of STI regions is configured as a second semiconductor strip; recessing the first semiconductor strip to form a first recess having a first depth; performing a first epitaxy to grow a first epitaxy strip in the first recess; recessing the second semiconductor strip to form a second recess; performing a second epitaxy to grow a second epitaxy strip in the second recess; recessing the first plurality of STI regions, with top surfaces of remaining portions of the first plurality of STI regions being higher than a bottom surface of the first epitaxy strip; and recessing the second plurality of STI regions, with top surfaces of remaining portions of the second plurality of STI regions being lower than a bottom surface of the second epitaxy strip.
 10. The method of claim 9, wherein a top portion of the first epitaxy strip forms a first semiconductor fin, and an entirety of the second epitaxy strip and a top portion of the second semiconductor strip forms a second semiconductor fin, and the method further comprises: forming a first gate dielectric and a first gate electrode on a top surface and a sidewall of the first semiconductor fin; and forming a second gate dielectric and a second gate electrode on a top surface and a sidewall of the second semiconductor fin.
 11. The method of claim 9, wherein the recessing the first plurality of STI regions and the recessing the second plurality of STI regions are performed in different etching processes.
 12. The method of claim 9, wherein the top surfaces of remaining portions of the first plurality of STI regions are higher than the top surfaces of remaining portions of the second plurality of STI regions.
 13. The method of claim 9, wherein the first epitaxy strip has a first bandgap greater than a bandgap of the semiconductor substrate, and the second epitaxy strip has a second bandgap smaller than the bandgap of the semiconductor substrate, and the first recess is deeper than the second recess.
 14. The method of claim 9, wherein the recessing the first plurality of STI regions and the second plurality of STI regions comprises etching the first plurality of STI regions and the plurality of STI regions simultaneously.
 15. The method of claim 9 further comprising performing planarization steps to level a top surface of the first epitaxy strip with a top surface of the second epitaxy strip.
 16. A method comprising: forming a first and a second plurality of shallow trench isolation (STI) regions in a semiconductor substrate, wherein a first portion of the semiconductor substrate between the first plurality of STI regions is configured as a first semiconductor strip, and a second portion of the semiconductor substrate between the second plurality of STI regions is configured as a second semiconductor strip; recessing the first semiconductor strip to form a first recess having a first depth; performing a first epitaxy to grow a first epitaxy strip in the first recess; recessing the second semiconductor strip to form a second recess having a second depth; performing a second epitaxy to grow a second epitaxy strip in the second recess; recessing the first plurality of STI regions, with first top surfaces of remaining portions of the first plurality of STI regions being higher than a bottom surface of the first epitaxy strip; and recessing the second plurality of STI regions, with second top surfaces of remaining portions of the second plurality of STI regions being lower than a bottom surface of the second epitaxy strip, and the second top surfaces are higher than the first top surfaces.
 17. The method of claim 16, wherein the first epitaxy strip has a first bandgap greater than a bandgap of the semiconductor substrate, and the second epitaxy strip has a second bandgap smaller than the bandgap of the semiconductor substrate.
 18. The method of claim 16 further comprising: forming a first gate dielectric and a first gate electrode on a top surface and sidewalls of the first epitaxy strip; and forming a second gate dielectric and a second gate electrode on a top surface and sidewalls of the second epitaxy strip.
 19. The method of claim 16 further comprising performing planarization steps to level a top surface of the first epitaxy strip with a top surface of the second epitaxy strip.
 20. The method of claim 16, wherein the first epitaxy strip and the second epitaxy strip are formed of different materials. 